IEEE EPS Japan Chapter
The objective of IEEE EPS
Japan Chapter is to promote scientific researches and knowledge
exchanges among its members in the fields of various kinds of
electrical parts and materials, the cutting-edge process technology,
packaging technology and industrial technology. These are essential for
realizing the state of art communication and information processing
equipment and terminal equipment which will support the multi-media
society in the coning millennium. Through the researches and the
knowledge exchanges, we promote the development of the industrial
society. Several international conferences, such as ICEP Symposium, are
held annually in which the members present their recent researches and
discuss vigorously. Sometimes, the symposiums on hot subjects are
organized under cooperation with related societies to promote timely
studies. Membership in IEEE EPS Japan Chapter provides the
latest technical information and various discounts. Join us today.
Thechnical Area
Core Technologies
-Materials
-Reliability
-Fiber Optics and Photonics
-Electrical Test
-Electrical Design, Modeling and Simulation
-Thermal Management and Thermomechanical Design
-Education
-Technology Trend
Components and Devices
-Electrical Contacts, Connectors and Cable
Packaging
-Discrete and Integrated Passives
-IC and Package Assembly
-High Density Substrates and Boards
-MEMS and Sensor Packaging
-Nano Packaging
-Power Electronics Packaging
-RF and Wireless
-Systems Packaging
-Wafer Level Packaging
Process and Manufacturing
-Electronics Manufacturing
-Green Electronics, Manufacturing, and Packaging
LINKS
IEEE EPS
IEEE Japan Council
Japan Institute of Electronics Packaging (JIEP)
IMAPS
Research Committee for 3D
Integration by Low-temperature Bonding Technology
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