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Welcome to
IEEE Dielectrics and Electrical Insulation Society Japan Chapter (DEI-32) !

IEEE Dielectrics and Electrical Insulation Society Japan Chapter (DEI-32) informs the related information in this site. We hope that the information is helpful to you.

information新着情報

November 17, 2021
Nomination has stared in "2021 IEEE DEIS Japan Chapter Student Best Papaer Presentation Award in International Conference & Best Papaer Presentation Award in Japanese Technical Meetings".
For the details, please see here.
March 9, 2021
Recients of 2020 IEEE DEIS Japan Chapter Student Best Paper Presentation Award in International Conference & Best Paper Presentation Award in Japanese Technical Meetings were decided. Award ceremony was held as a video conference due to COVID-19 pandemic. For the details, please see here.
February 6, 2021
The web-site has been redesigned.
January 13, 2021
Nomination has stared in "2020 IEEE DEIS Japan Chapter Student Best Papaer Presentation Award in International Conference & Best Papaer Presentation Award in Japanese Technical Meetings".
January 1, 2021
Board memebers are updated in 2021. For the details, please see here.


2021-2022 (From January 1, 2021 to December 31, 2022)

Chair
Naohiro HOZUMI
(Toyohashi University of Technology)
Vise Chair
Tsuguhiro TAKAHASHI
(Central Research Institute of Electric Power Industry (CRIEPI))
Secreatry
Hiroyuki NISHIKAWA
(Shibaura Institute of Technology)
Treasurer
Takahiro IMAI
(Toshiba Infrastructure Systems & Solutions Corporation)


Activities in 2021

 Chair Naohiro HOZUMI
(Toyohashi University of
Technology)
Vise Chair Tsuguhiro TAKAHASHI
(
Central Research Institute
of Electric Power Industry (CRIEPI))
 Secretary Hiroyuki NISHIKAWA
(Shibaura Institute of
Technology)
Treasurer Takahiro IMAI
(Toshiba Infrastructure
Systems & Solutions
Corporation)

January 22-23, 2021
Joint Technical Meeting on "Dielectrics and Electrical Insulation" ,
"Electrical Discharges, Plasma, and Pulsed Power Technology" and
"High Voltage engineering" [Online]
March 3, 2021
Technical Meeting on Dielectrics and Electrical Insulation [Online]
March 9, 2021
2020 IEEE DEIS Japan Chapter Best Paper Presentation Awards Ceremony (Online)
[Sending award certificate and extra prize by post]
March 12, 2021
Joint Technical Meeting on "Dielectrics and Electrical Insulation" and
"Electric Wire and Power Cable" [Online]
July 29, 2021
Technical Meeting on Dielectrics and Electrical Insulation [Online]
September 13-15, 2021
52nd Symposium on Electrical and Electronic insulating Materials and Applications in Systems [Vertual Web Conference]
November 19, 2021
Joint Technical Meeting on "Dielectrics and Electrical Insulation" and
"Electric Wire and Power Cable" [Akita University / Online]
December 20, 2021
Technical Meeting on Dielectrics and Electrical Insulation [Online]
 For the details, please see Japanese Site.



Activities in 2020

 Chair Yasuhiro TANAKA
(Tokyo City University)
Vise Chair Naohiro HOZUMI
(Toyohashi University of
Technology)
 Secretary Tsuguhiro TAKAHASHI
(Central Research Institute
of Electric Power Industry (CRIEPI))
Treasurer Hiroyuki NISHIKAWA
(Shibaura Institute of
Technology)


January 24-25, 2020
Joint Technical Meeting on "Dielectrics and Electrical Insulation" ,
"Electrical Discharges, Plasma, and Pulsed Power Technology" and
"High Voltage engineering" [Oita]
March 6, 2020
Joint Technical Meeting on "Dielectrics and Electrical Insulation" and
"Electric Wire and Power Cable" [Osaka]
(Canceled due to COVID-19 pandemic)
March 9, 2020
Technical Meeting on Dielectrics and Electrical Insulation [Tokyo]
(Canceled due to COVID-19 pandemic)
September 13-25, 2020
9th International Symposium on Electrical Insulating Materials
[Vertual Web Conference]
November 20, 2020
Joint Technical Meeting on "Dielectrics and Electrical Insulation" and
"Electric Wire and Power Cable" [Online]
December 16, 2020
Technical Meeting on Dielectrics and Electrical Insulation
[Aichi and Online]
--------------------
2019 IEEE DEIS Japan Chapter Best Paper Presentation Awards Ceremony (Canceled due to COVID-19 pandemic)
[Sending award certificate and extra prize by post]
For the details, please see Japanese Site



2021 IEEE DEIS Japan Chapter
Student Best Paper Presentation Award in International Conference
 &
Best Paper Presentation Award in Japanese Technical Meetings

Nomination has started in 2021 IEEE DEIS Japan Chapter Award on November 17, 2021.
We welcome your application.

Deadline for application: January 31, 2022

 For the details, please see Japanese Site.


---------------------------------------------------------------------------------------
2020 IEEE DEIS Japan Chapter
Student Best Paper Presentation Award in International Conference
 &
Best Paper Presentation Award in Japanese Technical Meetings
---------------------------------------------------------------------------------------

(Award ceremony was held as a video conference due to COVID-19 pandemic)


2020 IEEE DEIS Japan Chapter Student Best Paper Presentation Award
in International Conferences

Recipient Affiliation Title International
Conference
Hajime
SHIMAKAWA
The University of Tokyo Charge Accumulation/Decumulation on DC-GIS Spacer under 10,000-hour DC Field Application 2020 International Conference on Dielectrics
Tomofumi
SEKI
Waseda University Terahertz and Far-infrared Absorption Spectroscopic Study of DNA Bases 2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena
Takuto
MATSUI
Toyohashi University of Technology Nondestructive Fault Localization of Semiconductor Devices with Ultrasound Heating 2020 International Symposium on Electrical Insulating Materials



2020 IEEE DEIS Japan Chapter Best Paper Presentation Award
in Japanese Technical Meetings

Recipient Affiliation Title Japanese
Technical Meeting
Hiroyuki
ISHII
Waseda University Simultaneous Thermal and Radiation Aging of Soft and Hard Epoxy Resins
as Insulating Sealants in Nuclear Power Plants
Joint Technical Meeting on “Dielectrics and Electrical Insulation” and “Electric Wire and Power Cable”, IEE Japan (March 6, 2020)
Kosuke
SATO
Tokyo City University Estimation of Carrier Trap Depth in Epoxy Using A Space Charge Distribution Measurement and A Quantum Chemical Calculation Analysis Technical Meeting on Dielectrics and Electrical Insulation, IEE Japan (December 16, 2020)

 For the details, please see Japanese Site.



---------------------------------------------------------------------------------------
2019 IEEE DEIS Japan Chapter
Student Best Paper Presentation Award in International Conference
 &
Best Paper Presentation Award in Japanese Technical Meetings
---------------------------------------------------------------------------------------

(Award ceremony was canceled due to COVID-19 pandemic)


2019 IEEE DEIS Japan Chapter Student Best Paper Presentation Award
in International Conferences

Recipient Affiliation Title International
Conference
Shin NAKAMURA The University of Tokyo Effects Temperature on Electrical Treeing in Epoxy/Silica nanocomposites 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena
Ryosuke MINAMI Toyohashi University of Technology Electric and Thermal Properties of PMMA/h-BN Composite Insulating Materials Produced by Electrostatic Adsorption Method 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena
Keigo
MORI
Waseda University Relation Between the Glasss Transition and Dielectric Properties in Bisphenol A and F Epoxy Resins 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena



2019 IEEE DEIS Japan Chapter Best Paper Presentation Award
in Japanese Technical Meetings

Recipient Affiliation Title Japanese
Technical Meeting
Kumiko IGUCHI Tokyo City University Space Charge Distribution and Current Density Measurement in LDPE Insulating Material under Simulated Conditions for The Cable Operation Joint Technical Meeting on “Dielectrics and Electrical Insulation” and “Electric Wire and Power Cable”, IEE Japan
Norimitsu TAKAMURA Fukuoka University Influence on the Resistivity of Pure Water by Contacting with DLC Coated Spherical Electrode and by Adding Non-ionic Polymer Surfactant 50th Symposium on Electrical and Electronic Insulating Materials and Applications in Systems
Emiri NAGASE Waseda University Effects of Surface Treatment of Filler on the Mechanical and Dielectric Properties of Polyimide IEEJ Technical Meeting on Dielectrics and Electrical Insulating Materials

 For the details, please see Japanese Site.