IEEE Kansai Section 第71回技術講演会
The 71st IEEE Kansai Section Lecture Meeting

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IEEE Kansai Section
Chair Shigeru Katagiri
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IEEE Kansai Section 第71回技術講演会のご案内
The 71st IEEE Kansai Section Lecture Meeting

第71回は,ソウル大学の Kukjin Chun 教授 (IEEE Region 10 Vice Chair, 大 韓電子工学会 会長)をお招きし,


IEEE Kansai Section will have the 71st IEEE Kansai Section Lecture Meeting as follows.



「A Case Study of IT Convergence: Multi Mode/Band Transceiver」


・  Prof. Kukjin Chun (Seoul National University)

日時(Time & Date)

2012年7月20日(金) 10:30-11:30
10:30-11:30, Friday, July 20, 2012


大阪大学 情報科学研究科 A110 講義室
〒565-0871 大阪府吹田市山田丘1-5


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   講演「A Case Study of IT Convergence: Multi Mode/Band Transceiver」
    Prof. Kukjin Chun      (Seoul National University)


For convergence era, there is need for a device to support a wide range of frequencies. In addition, the demand for complex devices has been increased as various standards such as m-WiMAX, LTE, etc. emerge. In addition, the structure of a multi-mode /multi-band RF transceiver is shifted from a multi-chain architecture to a reconfigurable architecture. This shift is caused by the growth of wireless communications to include a common vision of the fourth generation of mobile communications, ubiquitous information access, higher data rates and higher mobility. To deal with this change, development of multi-mode / multi-band transceiver module based on reconfigurable RF technology will be a stepping-stone for future high speed wireless data communications.

In his talk, he will address a wireless transceiver which will be useful for 4th generation mobile communication covering mobile WiMAX and WLAN up to 5 GHz regime to match with IEEE 802.11n and 802.16e standard. The developed transceiver is 7cm x 3.5cm in its size and it has 2x2 MIMO and OFDM capacity with a single reconfigurable RFIC ranging 2-6GHz as well as quad-band switchable Front-end module (FEM) for band/mode selection. The reconfigurable RFIC has RF pins consisting of 2Rx I/O and 2Tx I/O and is fabricated as 9mm x 9mm MLF package at low cost. The size of the RFIC die was 5.7mm x 5.7mm and 81 inductors were used. The FEM is made of MEMS technology which is his research interest to reduce the size and power dissipation. The measured insertion loss of the developed FEM for Europe, America, and Korea was 5.9dB, 5.8dB, and 5.9dB, respectively. Using embedded PCB technology, the transceiver system was integrated and the area is 9% smaller than the area of non-embedded PCB.


Kukjin Chun is professor in the department of Electrical and Computer Engineering at Seoul National University (SNU), where he served as head of the department. He also was the director of the Inter-university Semiconductor Research Center of SNU, where he established government funded open infrastructure for MEMS fabrication which have been utilized by Samsung, LG and Hyundai. After receiving MS and PhD degree from the University of Michigan as well as BS degree from SNU, he joined Washington State University in 1986 and SNU in 1989. He is the President of the Institute of Electronics Engineers of Korea and the member of the National Academy of Engineering of Korea. He served as an editorial board member of Journal of Micromechanics and Microengineering and the Fellow of the Institute of Physics of UK. He is serving on the Advisory Committee of the Institute of Electrical Engineering of Japan and on the International Advisory Committee of the LIMMS of University of Tokyo.

The information on this lecture is at: をご覧ください。

参加費 (Fee)

無料 (Free)

参加申込み先 (Contact for registration)

IEEE関西支部 テクニカルプログラムコミッティ
Tel: (0774) 93 5518   Fax: (0774) 93 5158
E-mail: ieee-kansai-tpcアット

参加ご希望の方は7月19日(木)12時までに,Email(Faxでも結構です)にて以下をお知 らせください。

  • ご所属
  • お名前(ふりがな)
  • IEEE会員番号(会員の場合)

Please register in advance. E-mail or fax, IEEE member ID (if you have), your name, and affiliation by 12am, July 19, 2012 (Thursday).

本件連絡先 (For further information)

IEEE Kansai Section Technical Program Committee Chair
中谷 智広 (NTTコミュニケーション科学基礎研究所)


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