講演題目・概要: (1) Prof. Hua Wang (SSCS Distinguished Lecture) 題目: Merging Antenna Designs with Electronic Circuits ― Multi-Feed Antennas Based Mm-Wave Front-Ends in Silicon for On-Antenna Power Combining, Active Load Modulation, and Full Duplex Operations 概要: Conventionally, antennas and electronic designs are often treated as two distinct and separated domains: antenna designers handle the antennas; circuit designers deal with the electronics; and they only talk to each other over one single standard 50ohm interface. It is noteworthy that the far-field antenna radiation characteristics are completely governed by its local current and voltage distributions, suggesting the possibility of using "multiple distributed electronics feeds" to "actively synthesize" desired antenna responses and achieve "element-level antenna reconfigurability." The multi-feed antenna also can be viewed as a group of electrically small radiators, and the multiple feeds actively couple them together for collective high-performance radiation. Moreover, since on-chip antennas have become ubiquitous at mm-Wave and cost of adding more on-chip circuits are negligible, boundaries of these two domains are further blurred, and thus multi-feed antennas co-integrated with complex electronics now emerge as a very promising technology choice particularly for future mm-Wave massive MIMO systems. In this talk, we will present several recently reported multi-feed radiators co-integrated with complex transmitter/receiver electronics in silicon to achieve unprecedented mm-Wave front-end performance. On-chip or on-package multi-feed antennas can support low-loss on-antenna power combining and radiation impedance down-scaling in one single antenna footprint, radically pushing the limit of output power and efficiency for mm-Wave transmitters in silicon. The multi-feed antennas also enable on-antenna active load modulation, achieving high-efficiency on-antenna Doherty or Outphasing silicon-based transmitters with state-of-the-art energy efficiency. Furthermore, inherently wideband feed isolation can be explored in multi-feed antennas to realize world-first mm-Wave full-duplex chip-to-chip communication link with Gbit/s 64QAM signals. (2) Prof. Kenichi Okada (SSCS Distinguished Lecture) 題目: Millimeter-Wave Phased-Array Transceiver Design for 5G New Radio 概要: The wireless communication is one of the key technologies for realizing the future smart society. The conventional omni-directional wireless communication using microwave has been studied so far, and now the directional wireless communication using millimeter-wave (30-300GHz) is opening a new technology field of communication. The directional wireless communication using the millimeter-wave spectrum can accept spatial co-existence and multiplexing as well as use of wide frequency bandwidth. In this presentation, a millimeter-wave CMOS phased-array transceiver design is explained about phased-array architectures, phase shifters, power amplifiers, phase/gain calibration, measurement techniques, etc. The talk concludes with a discussion on future directions of millimeter-wave wireless communication, based on Shannon and Friis equations. (3) Prof. Ho-Jin Song (MTT-S Distinguished Microwave Lecture) 題目: Terahertz Communications at 300 GHz: Devices, Packages and System 概要: Recent progress in semiconductor devices on compound semiconductor or silicon substrates has made it possible to produce more power and receive a signal with less noise at THz frequencies. Various integrated circuits for the THz radio front-end functional blocks, including power and low-noise amplifiers, modulators and demodulators, and oscillators, have been demonstrated in the last decade. In the first experimental demonstration conducted in 2004, bulky instruments originally developed for THz spectroscopy were used to transmit pulsed THz signals carrying a 7-kHz bandwidth audio signal across a short free space. However, recently, there have been several successful demonstrations of multi-Gbps data transmissions at THz frequencies with state-of-the art devices and components. In this talk, the first prototype of a THz wireless communications system designed under the 'touch-and-go' scenario will be presented. I clarify the concept of the KIOSK data downloading system, cover some considerations in this work, and present a brief link-budget plan. We will then overview technologies for implementing THz components operating at 300 GHz and their performance, followed by preliminary investigation of the channel responses and the experimental demonstration results. At the end of the presentation, we will discuss several issues that need to be addressed for the future of the THz communications systems, in terms of system architectures, packaging and potential applications.