13th IEEE
Systems Packaging Japan Workshop (2010 SPJW)

Session schedule for 2010SPJW
[ Day1 : Keynote1 | Session1 | Session2 ]
[ Day2 : Keynote2 | Session3 | Session4 | Session5 | Session6 ]
[ Day3 : Technical Tour at ATR ]
Day1 (25-Jan-2010)
9:00 - 17:40 Resistration
10:00 - 10:10 Opening Remarks ( 10min )
General Chair: S.Saito (Mitsubishi Electric)
10:10 - 11:30 Keynote Session ( 40min x 2 )
    Session Chair: T. Nishino (Mitsubishi Electric)
  • Stepan Lucyszyn (Imperial College London), "Commercial applications for RF-MEMS"

    • Session Chair: Y. Tsukada (i-Packs)
  • Hiroshi Ishiguro (OSAKA Univ.), "The state of the art in Humanoid and Android Robotics"
11:35 - 12:25 Session1(I): Environmental Aspects ( 25min x 2 )
    Session Chair: S. Ogata (Oki Printed Circuits)
  • L. T. Yeh (Huawei Technologies), "Thermal Evaluations of Various Heat Sinks"
  • B. Pfahl (iNEMI), "The Evolving Direction for Environmental Programs in the Electronics Industry"
12:25 - 13:40 Lunch ( 75min )
13:40 - 14:30 Session1(II): Environmental Aspects ( 25min x 2 )
    Session Chair: S. Ogata (Oki Printed Circuits)
  • S. Novotny (Vette), "Green Field data center design - water cooling for maximum efficiency"
  • T. Fujimoto (Hitachi), "Optimzing the cost-effective and high performance datacenter as onehuge system packaging product from the customer's viewpoint"
14:30 - 14:50 Cofee Break ( 20min )
14:50 - 16:55 Session 2 : High Speed Signal Integrity ( 25min x 5 )
    Session Chair: R. Ninomiya (Toshiba), Robert C. Pfahl (iNEMI)
  • K. Hashimoto (Meisei Univ.), "Preliminary Study on High Speed and Long Distance Signal Transmission Assisted by Evanescent Wave Energy"
  • H. Osaka (Hitachi), "Power Integrity Design for Digital Consumer to High-End Information Products of HITACHI"
  • M. Okano (Toshiba), "PI/EMI in System Arch.Design phase"
  • K. Saito (Rambus), "The Design and Signal Integrity Analysis of a TB/sec Memory System"
  • T. Watanabe (Ansoft), "Understanding and Preventing EMI Through Simulation"
16:55 - 17:40 Break
17:40 - 18:00 Photo Session (attendee set) ( 20min )
18:00 - 20:00 Banquet ( 120min )
Toastmaster: M.Kimura (Renessas Technology)
    Banquet Speech ( 20min x 2 )
  • H. Shibata, "The Development of Medical Domain Specific SoC and its System in acapsule"
  • T. Watari, "A History of SPJW in 1990's"
20:00 - 21:00 Commitee Meeting ( 60min )

Day2 ( 26-Jan-2010 )
8:00 - 12:00 Resistration
8:30 - 9:10 Keynote Session ( 40min )
    Session Chair: Y. Taira (IBM,Japan)
  • Michael Nealon (IBM), "The first-level packaging challenge in the future high-performance systems"
9:15 - 10:30 Session 3(I) : Advanced Packaging ( 25min x 3 )
    Session Chair: Y. Fukuoka (Weisti)
  • Y. Tsukada (i-Packs), "Chip Packaging Interaction (tentative)"
  • K. Tanaka (Shinko Electric Industries), "Silicon substrate (tentative)"
  • D. L. Diehl (Applied Material Japan), "TSV Technology for Advanced 3D Wafer Level Interconnects"
10:30 - 10:50 Cofee Break ( 20min )
10:50 - 12:30 Session 3(II) : Advanced Packaging ( 25min x 4 )
    Session Chair: K. Terada (Kyocera SLC Technology), S. Oggioni (IBM,Italy)
  • S. Amakai (DNP), "Development of Thermal Performance of LSI Embedding Build-up PWBs"
  • N. Nakamura (Fujitsu Advanced Technologies Ltd.), "A reliability test method for solder joints of a bigger ceramic BGA"
  • R. Lee (Hong Kong Univ.), "Investigation on the Board Level Mechanical Reliability of BGA Mezzanine Connectors with Edgebonding"
  • H. Azimi (Intel), "High Density Flip Chip Packaging Challenges"
12:30 - 13:40 Lunch ( 70min )
13:40 - 14:55 Session 4 : Advanced Components (25min x 3 )
    Session Chair: K. Yokouchi (Fujitsu Interconnect Technology)
  • D. Kuchta (IBM), "Advances in High Speed Parallel Links for Computational System"
  • L. Dellmann (IBM), "3D opto-electrical device stacking on CMOS"
  • S. Oggioni (IBM), "Electro-optical integration technologies for future computing systems"
14:55 - 15:15 Cofee Break ( 20min )
15:15 - 16:30 Session 5 : High Performance Servers, IT Network System ( 25min x 3 )
    Session Chair: H. Go (Hitachi), R. Lee (HKUST)
  • Y. Katayama (IBM,Japan), "Optical memory access for high-end servers (tentative)"
  • K. Nakajima (Hitachi), "Hardware technologies of the BladeSymphony 2000 blade server"
  • J. Wei (Fujitsu Advanced Technologies Ltd.), "Hybrid Cooling for Fujitsu Large Computer Systems"
16:30 - 16:50 Cofee Break ( 20min )
16:50 - 18:30 Session 6 : Advanced Materials ( 25min x 4 )
    Session Chair: Y. Shimada (NEC), S. Novotny (Vette)
  • K. Suganuma (Osaka Univ.), "Nano-Ag printing technology (tentative)"
  • H. Endo (NEC), "Print Fabrication and Characterization of CNT Transistors on Plastic Films"
  • K. Yamanaka (Kyocera SLC Technology), "Flip-Chip Bonding on Ultra Low Coefficient of Thermal Expansion (CTE) and High Density Build-up Substrate"
  • Y. Kiuchi (NEC), "Development of Highly Functional Biomass-based Plastics for Electronic Equipments"
18:30 - 18:40 Closing Remarks ( 10min )

Day3 (27-Jan-2010)
8:50 Main Lobby of Hotel Granviaa Kyoto (2F)
9:00 - 10:00 ( Kyoto --> ATR )
10:00 - 12:00 Technical Tour at ATR ( 120min )
12:00 - 13:00 ( ATR --> Kyoto )
[ Top of this page | 2010SPJW Index page ]
[ Day1 : Keynote1 | Session1 | Session2 ]
[ Day2 : Keynote2 | Session3 | Session4 | Session5 | Session6 ]
[ Day3 : Technical Tour at ATR ]
Copyright(C) 2010 SPJW Committee
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